SET ACCμRA 100 键合机

法国SET的键合压力控制在不同的范围内采用了不同的高精度压力传感器，确保了在不同的压力范围内，都能够得到最佳的压力控制精度。

Applications
• Laser diode, laser bar • VCSEL, photo diode
• LED
• Prisms, lenses, mirrors • Micro assembly
• Flip-chip bonding, die bonding
• Chip-to-chip, chip-to-substrate bonding

Specifications
•Accuracy* ±0.5 μm
•Post-bond accuracy: +/- 1 μm
•Range of force :20 g to 100kg
•Temperature up to 450°C Independent heating for chip and substrate
•High resolution vertical movement 74 mm, resolution 0.05μm Driven by brushless motor

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